[代強者我同學po]
各位前輩好，
小弟為四大理工碩一，實驗室做模擬計算的。
前兩天收到台積實習面試邀請，細節如下：
--------------------------------------
A. 職務名稱: Process Development Engineer 2023 Intern
工作地點: 中科Taichung Site, 龍潭Longtan
B. 職務說明:
1) Develop expertise in advanced TCB bonding related process development
2) Drive development of new technology for semiconductor advanced packaging
bonding applications
3) Fundamental studies to validate the mechanism of defects that encountered
4) Work closely and collaborate with equipment suppliers, towards roadmap and
schedule alignment
5) Collaborate with equipment engineers to provide and receive feedback on
equipment/process interactions
C.職務需求:
1) Major in Mechanical Engineering, Materials Science and Engineering and
Chemical Engineering related fields.
2) Hands-on participation and a strong sense of ownership are required.
3) Strong technical problem-solving and analytical skills, based upon
fundamental and empirical models
4) Excellent teamwork capabilities, able to receive and provide inputs for
cross-functional projects
5) Have basic mechanical-related knowledge. Having the semiconductor
processes knowledge is a plus.
6) Basic written and spoken communication skills are required.
7) Being able to communicate in Mandarin and English
8) Strong Project management and priority handling skills with self-motivation
9) Have ability to edit code is a plus, such as Python, C#, C++, Matlab
------------------------------
根據關鍵字，看來是做先進封裝的，似乎很有前途(?)，
但好像還是產線缺，484 GG騙人的新手法?
再麻煩知道單位內部工作內容、風氣的前輩多給些資訊，感謝！
--